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Flexible Leadframe

The company is a producer of flexible leadframes. Our products are used in sectors including finance, mobile payments, aerospace, social security, telecom, healthcare, education, transportation, logistics, food, and public safety. We have earned consistent recognition from domestic and international customers through high-quality services and comprehensive after-sales support.

Module Assembly

Henghui provides customers with industry-leading smart card module packaging and testing solutions, offering one-stop packaging and testing services for products including 6PIN/8PIN contact modules, contactless modules, dual-interface modules, and customized modules. Products are widely used in core areas such as financial payment, identity recognition, and IoT security. Relying on an advanced R&D system and a strict quality system, our products demonstrate excellent stability and security in harsh environments, providing reliable hardware support for global digitalization.

Leadframe

HENGHUI high-precision etched metal leadframe factory is equipped with a 23,000m2 production workshop and supporting water and electricity facilities. It employs independently developed production technologies and has custom-imported internationally advanced production, testing equipment, and instruments. Utilizing maskless exposure technology and roll-to-roll continuous production processes, the factory offers a diverse product range covering thousands of series, including QFN, DFN, RTQFN, DRQFN, PPF, RTPPF, and wide-width QFN. With a current annual production capacity of 50 million strips, its products break international monopolies, fill domestic gaps, and widely replace imported alternatives. The company is committed to delivering continuous value to customers with first-class products and services.

eSIM Assembly

HENGHUI provides customers with one-stop packaging solutions, covering the entire process from wafer BG and sawing, packaging, FT testing, to IoT card personalization. The company has its own high-speed tin-plating line, and the packaging workshop is certified under the IATF16949 Quality Management System, with a monthly capacity of 35 million units. Main product series include DFN, QFN, and MP2, with a focus on etched leadframe packaging, committed to providing customers with high-reliability products and first-class services.

Quality Assurance

Equipped with industry-leading inspection instruments, comprehensive verification technologies, scientific quality management systems, and stringent process control protocols.