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Module Assembly

Henghui provides customers with industry-leading smart card module packaging and testing solutions, offering one-stop packaging and testing services for products including 6PIN/8PIN contact modules, contactless modules, dual-interface modules, and customized modules. Products are widely used in core areas such as financial payment, identity recognition, and IoT security. Relying on an advanced R&D system and a strict quality system, our products demonstrate excellent stability and security in harsh environments, providing reliable hardware support for global digitalization.

6PIN Dual-interface Smart Card Module

Module Thickness:

Max. 580μm


Application Area:

finance, social security, electronic currency, mobile payment, health, education, logistics, and public security, etc.


Features & Advantages:

Adapt to mainstream financial and security chips A variety of wires such as gold wire and alloy wire are available. The encapsulation technical supports both Glop top and Dam fill.